Al2O3- Sapphire Wafer, R Plane, 2" dia x 0.5mm, 2sp - ALR50D05C2 Nano Adhesive (Polyester-polyurethane): 4-5 g/m2 (Melting

Adhesive (Polyester-polyurethane):  4-5 g/m2                                           (Melting point:  150ºC )

5x10-6 (/oC)

1mm Weight 2

Silicon Wafer Specifications:

Al2O3- Sapphire Wafer, R Plane, 2" dia x 0.5mm, 2sp - ALR50D05C2 Nano Adhesive (Polyester-polyurethane): 4-5 g/m2 (MeltingFearures: R plane (1 102) orientation sapphire wafer is being used as a superconductor substrate due to less mis matched lattice and stable chemical and physical properties. Wafer size: 2" dia x 0. 5 mm thickness (1 102) C plane orientation + 0. 5o Polished surface: Both sides optically polished Surface roughness: < 5A by AFM Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with wafer container Precaution: R plane