P03700 - SEMI P37 - Specification for Extreme Ultraviolet Lithography Substrates and Blanks StdTpc-300 mm Carriers & Physical Interfaces flatted or notched compound semiconductor

flatted or notched compound semiconductor wafers

terms used to describe the characteristics of the edge profile of silicon wafers are named and their meaning is illustrated by a schematic drawing

All parts of the tube fittings tested by this method in contact with the internal fluid are made of fluorocarbon materials

without dependence on operator or host input

P03700 - SEMI P37 - Specification for Extreme Ultraviolet Lithography Substrates and Blanks StdTpc-300 mm Carriers & Physical Interfaces flatted or notched compound semiconductorThis Standard was technically approved by the Micropatterning Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 1, 2013. Available at www. semiviews. org and www. semi. org in June 2013; originally published November 2001; previously published November 2009. NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not