E04000 - SEMI E40 - Specification for Processing Management Revision:SEMI E40-96 - Superseded SEMI M38-0306 (technical revision)

SEMI M38-0306 (technical revision)

SEMI G21 — Specification for Plating Integrated Circuit Leadframes

本試験方法の目的は，ダイ剪断強度試験用の手順を決定することである。

This test is intended to show the effect of corrosion caused when a corrosive gas such as HCl is contaminated by an oxidizer such as atmospheric moisture

E04000 - SEMI E40 - Specification for Processing Management Revision:SEMI E40-96 - Superseded SEMI M38-0306 (technical revision)* This Standard has the option to purchase the Current document with a redline document (Current + Redline). The redline document is included with the Current document as a comparison tool to help identify changes that have been made between the Current version and the previous version (Superseded). If differences should exist between the redline document and the Current document, the Current version is the official and authoritative version. 1